31st August 2020

PCB's and stencils are in!

A fair few different boards there including the various production aids, and the panels themselves :

I assembled an assembly jig! Looks like it will do the job:

I'm still finalising the flash image that will go on the units, and getting all the packaging sorted out, but we're getting close now! I'm hoping to assemble the first panel later this week, then testing, then they will be available for sale.

In regard to the packaging, the boards will ship pressed into a small block of conductive foam, and sealed within a resealable antistatic bag. The original D0 ROM and 74LS138 you remove from the motherboard to install ROM X can then be seated into the conductive foam and put in the antistatic bag for safekeeping :-) Same with the character ROM.

Previous Post Next Post